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 We understand your needs require flexibility. In response to your specific service requirements, we offer foundry services for custom designs, design support, and a variety of packaging options and test options for superior products. |
SOI Foundry
In the fast paced IC commercial industry, we understand that you need to deliver your products on time and meeting above average performance demands to retain a competitive edge. By partnering with Honeywell for our RF/Microwave wafer foundry service, you have the potential to exceed your customer's performance and delivery expectations, while improving your own bottom line earnings. Whether your needs are on a project-by-project or ongoing basis, we provide you with the flexibility you need, offering you an a la carte menu of services.
With our foundry, you can take advantage of our 0.8 micron SOI CMOS processes. You can also reduce the cost and increase the performance of your mixed mode designs by integrating RF, analog, digital and passive elements into a single monolithic component.
Benefits of SOI Technology
Using your designs and the Honeywell SOI RF/Microwave foundry collaboratively, we can produce the ideal solution for low power cellular, PCS, GSM base-station and handset applications in the 900Mhz to 5.8GHz frequency bands.
There are inherent benefits of SOI CMOS over bulk CMOS and GaAs technology. The insulating layer provides isolation to the substrate which reduces leakage and capacitance resulting in higher speeds, lower power and much faster switching speeds. It also enables The cost savings to you is enabling the integration of active MOSFET devices for RF, digital, and analog functions with passive elements, all on a single chip. This fundamental advantage over bulk Silicon and GaAs technologies enables the creation of highly integrated RFICs, thereby reducing the power consumption and physical space needed for the RFICs in your new products.
Contact us today to discuss terms of foundry service agreement and our customized options tailored to meet your needs.
Design Services
When you develop a Foundry Service Agreement with Honeywell, you will receive support from our team of designers, application engineers and project managers. We offer detailed design support from a dedicated, experienced microwave designer or design team.
Honeywell prides itself in its heritage as a leading manufacturer of IC solutions spanning over 20 years. Together with experience in designing and an unsurpassed level of expertise in silicon-on-insulator technology, we can provide aggressive, flexible design support.
If your designs are developed for GaAs technology, our designers can convert your existing multi-chip gallium arsenide designs into SOI-based devices.
You can trust a Honeywell design team to help you meeting the most sophisticated requirements and will respond quickly to your demanding industry.
Packaging Services
We understand that a wide variety of packaging options are necessary for your specific applications, and Honeywell offers you the flexibility you need.
By choosing Honeywell, you have a variety of packaging options available -- such as wafer thinning, backside gold, and bumping to fully packaged products --to optimize your solutions.
We provide high quality, fast delivery and custom wafers for large volume or limited production needs.
Let us know how we can deliver our wafers to address the flexibility of your specifications.
Test Services
To consistently ensure our high standard of quality wafers, Honeywell offers test services -- a comprehensive series of test services, from PM testing of wafers to DC and RF characterizations of package components.
In addition to providing basic digital, analog and DC wafer level probe testing (using our Schlumberger digital IC or Teradyne analog IC testers), we also offer final package level at-speed performance testing through our third party test service partners. |
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