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Value-Added Production Engineering | |
 Electrical Test/Burn-In
Using advanced test hardware and software tools, we provide cost effective testing of your products. Our test data management system combines the hardware for data storage, mapping, analysis and customized reporting.
In addition to digital and analog testing, we also offer laser trimming, ARACOR radiation testing systems and thermostream temperature testing capability. Burn-in services include static and dynamic capability, custom board design and fabrication. |
Honeywell's Integrated Circuit Packaging
Honeywell has a long history of delivering radiation hardened ICs in single chip packages and multi-chip modules (MCMs) for space and military applications beginning in the 1970's. The technology includes legacy leaded flatpacks and dual-in-line packages (DIPs), to 1152 I/O Ball Grid Arrays and MCMs with stacked die.
Packaging Qualifications
The Honeywell packages are manufactured and screened to meet the demanding electrical, thermal and radiation requirements of space and military applications. | |
 | | Design, Assembly, Screening Processes Certified To MIL-PRF-38535 | | | MIL-PRF-38535 Qualified Manufacturer For Both "Q" Level Tactical Devices And "V" Level Space Application, Along With Class S And Class B | | | MIL-STD-883 DESC Certified For All Screening Test Methods | | | Radiation Hardened for Total Dose and Dose Rate |
New Package Development
New technology development continues to support packaging needs driven by: |
| | Higher I/O Counts | | | Increasing Pin Count At The Package Level | | | Reduction In Packaging Costs | | | Increasing Clock Speeds Requiring Lower Package Parasitics |
| Honeywell continues with development of flip chip technology into a variety of substrates including ceramic, ball grid arrays for ICs with up to 1000 input/output signals. Contact Honeywell for latest available packages. |
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