Honeywell Materials Help Mobile Devices Stay Cool; Perform Better
September 26, 2014
Leading mobile electronics manufacturers are using Honeywell’s thermal interface materials (TIMs) to dissipate the intense heat produced by increasingly powerful chips at the heart of these devices. If not managed properly, the heat can lead to performance issues and even cause the devices to crash.
“End users demand a lot from their devices and our materials help manufacturers manage heat that can threaten performance and longevity,” said David Diggs, vice president and general manager of Honeywell Electronic Materials. “Our TIM product offerings, which are based on more than a half century of knowledge developing materials for the semiconductor industry, are helping device manufacturers meet the growing expectations as mobile devices continue to be central to everyday life.”
TIMs technology from Honeywell transfers thermal energy from the chip to the heat sink or spreader, where it is dissipated into the surrounding environment. This functionality keeps the chip cool while allowing the heat sink module to perform optimally.
For more information, read the press release.