The new plating anodes for semiconductor packaging wafer bumping applications expand Honeywell's RadLo offerings and employ proprietary Honeywell metrology and refining techniques.
"Our new low alpha plating anodes are already in high volume manufacturing at leading sub-contractors and have been qualified with OEM tool manufacturers," said Chris Lee, product line director for Honeywell's Advanced Metals and Polymers business. "The qualifications and rapid adoption demonstrate that we are serving an important need and helping our customers meet their challenges."
Alpha particle radiation emanating from semiconductor packaging materials can cause data errors in memory cells, creating soft errors that can ultimately cause mobile phones, tablets, servers, gaming consoles, and other end use devices to malfunction. As semiconductors shrink and functional demands increase, chips are more sensitive to soft errors. Designers of packaging materials for semiconductors are now turning to low alpha materials such as Honeywell's RadLo line to address the issue effectively.
At such extremely low alpha emission levels, accurate measurement of alpha flux is difficult due to the effects of contaminants and background radiation such as cosmic rays. To address this issue, Honeywell employs robust metrology and process controls.
The introduction of the RadLo anodes also supports the semiconductor industry's move toward flip chip packaging and the increased adoption of electroplating for wafer bumping applications. Honeywell is uniquely positioned to manufacture plating anodes for use in wafer bumping with very high-purity (>99.99% pure) metal offerings, including low alpha lead (Pb), low alpha tin (Sn) and copper (Cu). Low alpha Sn anodes are available in several low alpha grades, including <0.002 counts per hour/cm2.
Honeywell (www.honeywell.com) is a Fortune 100 diversified technology and manufacturing leader, serving customers worldwide with aerospace products and services; control technologies for buildings, homes and industry; turbochargers; and performance materials. Based in Morris Township, N.J., Honeywell's shares are traded on the New York, London, and Chicago Stock Exchanges.
This release contains certain statements that may be deemed "forward-looking statements" within the meaning of Section 21E of the Securities Exchange Act of 1934. All statements, other than statements of historical fact, that address activities, events or developments that we or our management intends, expects, projects, believes or anticipates will or may occur in the future are forward-looking statements. Such statements are based upon certain assumptions and assessments made by our management in light of their experience and their perception of historical trends, current economic and industry conditions, expected future developments and other factors they believe to be appropriate. The forward-looking statements included in this release are also subject to a number of material risks and uncertainties, including but not limited to economic, competitive, governmental, and technological factors affecting our operations, markets, products, services and prices. Such forward-looking statements are not guarantees of future performance, and actual results, developments and business decisions may differ from those envisaged by such forward-looking statements. We identify the principal risks and uncertainties that affect our performance in our Form 10-K and other filings with the Securities and Exchange Commission.